Today, Samsung introduced a newly enhanced version of their 16 GB DDR5 DRAM product line. The memory is constructed using a technology that has a process class of 12 nanometers, which is an improvement from the 14-nanometer EUV product that is already on the market.
It was announced that the new DDR5 DRAM would be compatible with AMD products, and it was designed and certified on Zen systems to achieve this compatibility.
According to Jooyoung Lee, Executive Vice President of DRAM Products and Technology at Samsung, the newly established standard is going to be a crucial enabler in pushing the market-wide adoption of DDR5 DRAM.
It is made with the use of a novel material that boosts cell capacitance and proprietary design technique that improves crucial circuit properties. Both of these factors contribute to the product’s overall performance.
EUV (Extreme ultraviolet) lithography is the foundation of the new DRAM, which makes it possible to achieve a higher die density and improve wafer productivity by 20%. It also has a 23% lower power consumption, which paves the way for more eco-friendly business practises among information technology organisations.
It is anticipated that the first memory sticks equipped with the advanced DDR5 DRAM will begin shipping in the year 2023.
